Process integration engineers are gradually losing their battle to keep process variations hidden behind the defensive barrier of tight design rules. Variations in metal line widths, layer thicknesses ...
How to avoid wafer-based testing during early technology development using a model to determine the optimal Si recess depth target and process window prior to source/drain epitaxy. A new methodology ...
Performance metrics for processes are an area of much regulatory interest currently. There isn’t always a readily available clear definition of what is needed, however, and guidance from regulators is ...
A new methodology to assess the impact of fabrication inherent process variability on 14-nm fin field effect transistor (FinFET) device performance. August 18th, 2021 - By: Coventor A new methodology ...
This asynchronous course addresses the basic theory behind Statistical Process Control (SPC), a method used in monitoring and controlling the quality of a process through statistical analysis to ...
Statistical Process Control (SPC) provides the means for the control of product quality and the reduction of process variation. To be successful you need to know how to collect data, understand the ...
In this, the fifth instalment of the "Let's Talk PVT Monitoring" series I chat with Oliver King about monitoring in-chip conditions in modern SoCs and this time we discuss process detection and ...
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