A new technique measures free-form wafer shape, write Marco Franchi, Wooptix, and Leon van Dijk, Ronald Otten, Richard Van Haren, ASML. On-product overlay (OPO) is one of the most critical parameters ...
Parallel piezo aligners with fly height sensors enable faster PIC wafer testing. Parallel miniaturized piezoelectric alignment engines with fly-height sensors enable faster PIC wafer testing. Image ...
One of the contributors to layer-to-layer overlay in today’s chip manufacturing process is wafer distortion due to thin film deposition. Mismatch in the film specific material parameters (e.g., ...
In what is being described as a breakthrough for the future of die-to-wafer (D2W) bonding, CEA-Leti and Intel have optimised a hybrid direct-bonding, self-assembly process that has the potential to ...
Unable to scale horizontally, due to a combination of lithography delays and power constraints, manufacturers are stacking devices vertically. This has become essential as the proliferation of mobile ...
SAN DIEGO – June 2, 2022 – In a breakthrough for the future of die-to-wafer (D2W) bonding, CEA-Leti and Intel have optimized a hybrid direct-bonding, self-assembly process that has the potential to ...
The precision required poses several challenges for testing and packaging procedures, necessitating the precise alignment of fiber optic devices in high-throughput production settings. PI offers ...
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